oxygenfree copper

用法例句

Brazing between high purity alumina ceramic and oxygen-free copper;

高纯氧化铝陶瓷与无氧铜的钎焊

A novel technology of electromagnetic deoxidization (EMD) & electromagnetic continuous casting (EMC) for quality oxygen-free copper (OFC) processing was presented and industrial experiments and the production of OFC with this technology were completed.

提出一种在国内企业现有装备基础上生产高性能无氧铜的电磁脱氧-电磁连铸的方法,并完成工业试验和批量生产。

Inconnectionwiththe technological characteristics ofthe productionofoxygen-free copper,factors whichinfluence the quality of oxygen-free copper are analysed,including:the productive methods,original and auxi-material,technologies for smelting and casting and inspectional methods.

针对无氧铜生产的工艺特点 ,分析了原辅材料、熔铸工艺及检测方法等对无氧铜产品质量的影响 ,并结合国内无氧铜生产现状 ,提出了保证和稳定无氧铜产品质量的控制措施。

Gas Hole Characteristics and Forming Mechanism of Oxygen Free Copper Rod with Up Casting;

上引铸造无氧铜杆的气孔特征及其形成机理

This paper introduces the qualities and applications of oxygen free copper,analyzes its production technology together with its main factors influencing its quality,points out the measures for controlling the quality and studies the means for eliminating the sources of oxygen.

介绍了无氧铜的性能和用途,分析了无氧铜生产的工艺,以及影响无氧铜质量的主要因素,提出了控制无氧铜质量的措施,尤其是在排除氧的来源方面作了研究。

Effect of trace Ag on the properties of oxygen free copper was studied.

1% )对无氧铜性能的影响 ,结果表明 :经Ag强化的无氧铜银合金 ,在电导率下降甚少的情况下 ,显著提高了抗拉强度、硬度和软化温度。

The determination of nitride and oxide contents of OFHC copper and Cu Cr alloy are described especially.

介绍了TC 4 36N/O测定仪的结构、原理及其在真空电子材料中的应用 ,着重对无氧铜、Cr Cu合金中的N ,O气体含量测定 ,作了较多的论述。

The dynamic release behavior of OFHC copper under 10~20 GPa shock pressure was simulated by using the Johnson-Cook(JC) constitutive model and Steinberg-Cochran-Guinan(SCG) constitutive model,respectively.

分别利用Johnson-Cook(JC)本构模型和Steinberg-Cochran-Guinan(SCG)本构模型对无氧铜在10~20 GPa冲击压力下的卸载过程进行了数值模拟,与冲击-卸载实验结果比较表明,在这样的冲击压力下无氧铜的应变率效应仍然明显,JC模型对无氧铜的动态卸载行为有较好的描述。

The determination of nitride and oxide contents of OFHC copper and Cu-Cr alloy are described especially.

介绍了TC-436 N/O测定仪的结构、原理及其在真空电子材料中的应用,着重对无氧铜、Cr-Cu合金中的N,O气体含量测定,作了较多的论述。

Effects of RE on Technological Processing and Product Properties of Oxygen Free Copper Rod;

稀土对无氧铜杆生产工艺及产品性能的影响

Research on forming process of zirconium oxygen-free copper alloy applied to shrink ratio power chamber;

缩比动力室用锆无氧铜材料的成型工艺研究

Amtel tellurium copper

阿姆特尔含碲无氧铜

Oxygen free copper sheets and strips

GB/T14594-1993无氧铜板和带

DETERMINATION OF OXYGEN IN OXYGEN FREE COPPER ROD USING TC600 OXYGEN/NITROGEN DETERMINATOR

TC600氧氮分析仪测定无氧铜杆中氧

Amcrom chromium copper

阿姆克龙含铬无氧铜合金

Application of separable connected furnace in the production of oxygen-free cooper wire rod

分连体炉在无氧铜杆生产线上的应用

Spall of cylindrical copper by converging sliding detonation

内爆和柱壳条件下无氧铜的层裂特性

Experimental investigation for damage mechanism of OFHC under high-velocity impact

高速撞击下无氧铜破坏机理实验研究

Experimental Study on Deep-hole Trepanning Technology for Oxygen-free Copper

无氧铜深孔套料加工工艺的试验研究

EFFECT OF HEAT TREATMENT ON SURFACE QUALITY OF DIAMOND TOOL TURNED OFHC(UT2)

热处理对无氧铜超精加工表面质量的影响

Application of RE Addition to Oxygen Free Copper Bar by Up Casting

稀土添加剂在上引铸造无氧铜杆工艺中的应用

Necking and Fracture of Oxygen-Free high Conductive Copper Bars Subjected to high Strain Rate Tension

高导无氧铜杆高应变率拉伸下的颈缩与断裂

On constitutive models of oxygen-free high-conductivity copper at high pressure and high strain rates

高导无氧铜的高压与高应变率本构模型研究

The equipments and technology of dip forming used in U.S.and Japan for manufucturing copper rod free of oxgen are introduced in detail.

详细介绍了美国及日本生产无氧铜杆的浸渍成型设备及工艺流程。

Research on Radiation Behaviors and Temperatures of Copper/sapphire Interface under Shock Compression;

无氧铜/蓝宝石界面冲击辐射特性及温度测量研究

A cylinder-plate impact test for oxygen-free high-conductivity copper and comparison of effects of three constitutive models

高导无氧铜圆柱-平板冲击实验及不同本构模型效果比较

Tin free, polishing anifouling composition with cuprous oxide.

含氧化亚铜的无锡自抛光防污涂料。

Preparation of Copper-Clad Laminates of Halogen-Free Flame Retardant Phosphoric Epoxy Resin

无卤阻燃含磷环氧树脂覆铜板的制备

Oxidize copper to copper oxide.

使铜氧化变成氧化铜。